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High-dimensional Optical I/O on Silicon Photonics Integration Platform

发布日期:2024-01-05     点击量:
报告题目: High-dimensional Optical I/O on Silicon Photonics Integration Platform
报告专家: Yeyu Tong, Assistant Professor, Microelectronics, Function, the Hong Kong University of Science and Technology (Guangzhou)
报告地点: 物理楼中楼215
报告时间: 2024年1月17日 (星期三) 13:30-15:00
联 系 人: 王剑威(Tel: 62758257)
专家介绍: Yeyu Tong is Assistant Professor at the Microelectronics Thrust, Function Hub of Hong Kong University of Science and Technology (Guangzhou). His research interests include integrated optics, optical communications, optical signal processing and computing, optical I/O chiplets, and photonic design automation. Prior to joining HKUST(GZ) in 2022, he was an R&D Engineer working on silicon photonics technology for high-capacity optical I/O at Interuniversity Microelectronics Center (imec) headquartered in Leuven, Belgium. He received his PhD degree from the Chinese University of Hong Kong and BEng degree from University of Electronic Science and Technology of China in 2020 and 2016, respectively. He was a visiting graduate student at the University of California, Santa Barbara in 2019. He has authored and co-authored more than 55 publications including book chapters, journals, and international conferences.

Mode-division multiplexing in optical fibers enables the transmission of multiple orthogonal channels for various applications, including optical interconnects, quantum networks, imaging, and sensing. However, implementing high-dimensional optical fiber systems often requires bulky optics to launch different fiber modes and complex digital electronic signal processing to unscramble the modes within the multimode optical fiber. To address these challenges, we have developed a compact and efficient solution to bridge the few-mode fibers (FMFs) with silicon photonic integrated circuits that support up to eight spatial and polarization channels. High-dimensional and high-bandwidth chip-to-chip optical interconnects can thus be enabled with reconfigurable integrated photonic processors.

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